FusionStor Invento i670


Salient Features
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4- 2400MHz ; 24x DIMM slots
3. 1x2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot
4. Quad LAN w/ Intel® i350 GbE
5. 8 x 2.5" hot-swap SAS/SATA drive bay, 1 x 5.25" drive bay
6. 3 x 8cm high-performance PWM fan(s)
7. 720W Redundant Power Supply 80Plus Gold (92% Efficiency)


Processor Support 2 X Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s

Core Logic Intel® C612 chipset

Memory 24x DIMM slots ;
Up to 3TB ECC 3DS LRDIMM, up to DDR4- 2400MHz

PCIe Expansion Slot 1x2 PCI-E 3.0 x16,
3 PCI-E 3.0 x8, and
1 PCI-E 2.0 x4 (in x8) slot

RAID Options AHCI SATA:- SATA3 (6Gbps); RAID 0, 1, 5, 10
SCU SATA:- SATA3 (6Gbps); RAID 0, 1, 5, 10

Drive Bays 8 x 2.5" hot-swap SAS/SATA drive bay, 1 x 5.25" drive bay


Networking • 4x RJ45 Gigabit Ethernet LAN ports
• 1x RJ45 Dedicated IPMI LAN port

IPMI feature • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
• ASPEED AST2400 BMC

Onboard I/O SATA:- 10x SATA3 (6Gbps) ports
USB:- 5x USB 3.0 (2 rear, 2 front panel, 1 Type A), 4x USB 2.0 ports (2
rear, 2 front panel)
Video:- 1x VGA port
Serial Port / Header:- 2x Fast UART 16550 serial, 2x COM Ports (1 rear,
1 header)
DOM:- 2x DOM (Disk on Module) ports
TPM:- 1x TPM Header

Power Supply 720W Redundant Power Supply 80Plus Gold (92% Efficiency)

Dimension / Form Factor 2U Rackmount