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Invento i700e Purley Series


Salient Features
• Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8
• Dual LAN with 10GBase-T with Intel® X722 + X557
• 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
• 3x Middle 8cm (9400 rpm) PWM Fans & 2x 8cm (9400 rpm) PWM Fans
• 1280W (1 + 1) Redundant Platinum Level Certified High-Efficiency Power Supply


Processor Support 2 X Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s

Core Logic Intel® C622 chipset

Memory • 16x DIMM slots;
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM

PCIe Expansion Slot • PCI-E:-
- 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8

• M.2:- - M.2 Interface: PCI-E 3.0 x4
- Form Factor: 2260, 2280, 22110
- Key: M-Key

RAID Options • SATA :- Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 3x 5.25" External HDD Drive Bays &
• 8x 3.5" Hot-Swappable HDD Drives

Cooling Feature • 3x Middle 8cm (9400 rpm) PWM Fans & 2x 8cm (9400 rpm) PWM Fans

Network Controllers • Dual LAN with 10GBase-T with Intel® X722 + X557

Graphics • Aspeed AST2500 BMC

Onboard I/O • SATA:- 14 SATA3 (6Gbps) port
• USB:- 4 USB 2.0 ports (2 rear + 2 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
• Video Output:- 1 VGA port
• Serial Port / Header:- 2 COM Ports (1 rear, 1 header)
• TPM:- 1 TPM Header

Power Supply 1280W (1+1) Redundant Platinum Level Certified High-Efficiency Power Supply (95% efficiency)

Dimension / Form Factor 4U/Tower