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Invento i602 EPYC Series


Salient Features
Four Hot-Pluggable Systems (Nodes) in a 2U form factor.
Each Node supports the following:
• Dual AMD EPYC™ 7001/7002* Series Processors (*AMD EPYC 7002 series drop-in support requires board revision 2.x)
• 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs (7001 Processors); 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required + 7002 Processors)
• 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
• Integrated IPMI 2.0 + KVM with dedicated LAN
• 4 Heavy duty 8cm PWM fans
• 6 Hot-swap 2.5" SATA3 drive bays
• 2200W Redundant Power Supplies Titanium Level (96% Efficiency) (Full redundancy based on configuration and application load)


Processor Support 2 X Dual AMD EPYC™ 7001/7002 Series Processors

Core Logic System on Chip

Memory • 16 x DIMM slots;
• Up to 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs (7001 Processors)
• Up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required + 7002 Processors)

PCIe Expansion Slot • PCI-Express:
- 2 PCI-E 3.0 (x16) Low-profile slots and
- 1 SIOM card support (must bundle with network card)
• M.2:
- Interface: 1 SATA/PCI-E 3.0 x4
- Form Factor: 2280, 22110
- Key: M-key

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
• ASPEED AST2500 BMC

Drive Bays • 6 Hot-swap 2.5" SATA3 drive bays

Cooling Feature • 4 Heavy duty 8cm PWM fans

Onboard I/O • LAN:- Provided via SIOM (optional), 1 RJ45 Dedicated IPMI LAN port
• USB:- 2 USB 3.0 ports (rear)
• Video:- 1 VGA port
• DOM:- 1 DOM (Disk on Module) port
• Others :- 1 COM port (header), 1 TPM 2.0 header

Power Supply • 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Dimension / Form Factor 2U Rackmount