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Invento i603 EPYC Series


Salient Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
• Dual AMD EPYC™ 7002 Series Processors
• Up to 4TB ECC 3DS LRDIMM,up to DDR4-3200MHz; 16 DIMM slots
• 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
• Integrated IPMI 2.0 + KVM with dedicated LAN
• 4 Heavy duty 8cm PWM fans
• 6 Hot-swap 2.5" SATA3 drive bays
• 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)


Processor Support 2 X AMD EPYC™ 7002 Series Processors

Core Logic System on Chip

Memory • 16x DIMM slots;
• Up to 4TB ECC 3DS LRDIMM, up to DDR4-3200MHz

PCIe Expansion Slot • PCI-Express:
- 2 PCI-E 4.0 (x16) Low-profile slots and
- 1 SIOM card support (must bundle with network card)
• M.2:
- Interface: 1 SATA/PCI-E 3.0 x4
- Form Factor: 2280, 22110
- Key: M-key

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
• ASPEED AST2500 BMC

Drive Bays • 6 Hot-swap 2.5" SATA3 drive bays

Cooling Feature • 4 Heavy duty 8cm PWM fans

Onboard I/O • LAN:- Provided via SIOM (optional), 1 RJ45 Dedicated IPMI LAN port
• USB:- 2 USB 3.0 ports (rear)
• Video:- 1 VGA port
• DOM:- 1 DOM (Disk on Module) port
• Others :- 1 COM port (header), 1 TPM 2.0 header

Power Supply • 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Dimension / Form Factor 2U Rackmount