FusionStor Invento i6071 Series


Salient Features
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
2. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots
3. 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
4. 6 USB 3.0 ports (4 rear + 2 via headers)
5. Dual LAN with 10Gbase-T from C622
6. ASPEED AST2500 BMC
7. 8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bays
8. 600W/650W Redundant Power Supply 80PLUS Platinum (94% Efficiency)
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
2. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots
3. 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
4. 6 USB 3.0 ports (4 rear + 2 via headers)
5. Dual LAN with 10Gbase-T from C622
6. ASPEED AST2500 BMC
7. 8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bays
8. 600W/650W Redundant Power Supply 80PLUS Platinum (94% Efficiency)
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