Invento i615e Series


Salient Features
Four hot-pluggable systems (nodes) in a 2U form factor.
Each node supports the following:
• Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600v4/ v3 family; QPI up to 9.6GT/s
• Up to 1TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 8x DIMM slots
• 1x PCI-E 3.0 (x16) low-profile slot
• 3x 3.5" Hot-swap SATA3 drive bays
• 4 heavy duty fans
• Intel® i350 Dual port GbE LAN
• 1600W Redundant Power Supplies Titanium Level (96% Efficiency)
Four hot-pluggable systems (nodes) in a 2U form factor.
Each node supports the following:
• Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600v4/ v3 family; QPI up to 9.6GT/s
• Up to 1TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 8x DIMM slots
• 1x PCI-E 3.0 (x16) low-profile slot
• 3x 3.5" Hot-swap SATA3 drive bays
• 4 heavy duty fans
• Intel® i350 Dual port GbE LAN
• 1600W Redundant Power Supplies Titanium Level (96% Efficiency)
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