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Invento i616e Purley Series

Salient Features
Four hot-pluggable systems (nodes) in a 2U form factor. Specification of Each node supports the following:
• Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
• Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane™ DCPMM; 24 DIMM slots
• 1 PCI-E 3.0 (x16) Low-profile slot; 1 SIOM card support
• 6 Hot-swap 2.5" SAS3 drive bays or 4 NVMe + 2 SAS3 Hot-swap 2.5"
• 4 Heavy duty PWM fans
• 2200W Redundant Power Supplies Titanium Level (96%)

Specification

Processor Support

2 X 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)

Core Logic

Intel® C621 chipset

Memory

24x DIMM slots
Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane™ DCPMM

PCIe Expansion Slot

• 1 PCI-E 3.0 (x16) Low-profile slot
• 1 SIOM card support (must bundle with network card)

RAID Options

SAS:- SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60

Drive Bays

• Hot Swap:-
- 6 Hot-swap 2.5" SAS3 drive bays or 4 NVMe + 2 SAS3 Hot-swap 2.5"
• M.2:-
- 2 M.2 NVMe or SATA (2240/2260/2280) via optional Add on card

Cooling Feature

• 4 Heavy duty PWM fans with air shroud

IPMI

• Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Onboard I/O

LAN:- 1 RJ45 Dedicated IPMI LAN port
USB:- 2 USB 3.0 ports (rear)
Video:- 1 VGA port
DOM:- 1 DOM (Disk on Module) port

Power Supply

2200W Redundant Power Supplies Titanium Level (96%) 80PLUS

Dimension / Form Factor

2U Rackmount

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