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Invento i617 Purley Series

Salient Features
Used for Compute Intensive Application, HPC, Data Center, Enterprise Server, Financial Analysis, Missioncritical applications
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:-
1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slots
4. 6 Hot-swap 2.5" SATA3 drive bays
5. 4 Heavy duty 8cm PWM fans with optimal fan speed control
6. 2200W Redundant Power Supply

Processor Support 2 X Intel® Xeon® Scalable Proc essors, Dual UPI up to 10.4GT/s

Core Logic Intel® C621 chipset

Memory 16x DIMM slots;
Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz

PCIe Expansion Slot • 2 PCI-E 3.0 x16 (LP) slots

RAID Options SATA3 (6Gbps); RAID 0, 1, 5, 10 support

Drive Bays • 6 Hot-swap 2.5" SATA3 drive bays

Networking • 1 RJ45 Dedicated IPMI LAN port

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Onboard I/O SATA:- 6 SATA3 (6Gbps) ports
USB:- 2 USB 3.0 ports (rear)
VGA:- 1 VGA port
Serial Port / Header:- 1 Fast UART 16550 port / 1 Header (internal)
Others:- 2 DOM support on the motherboard

Power Supply 2200W Redundant Power Supply 80PLUS Titanium level

Dimension / Form Factor 2U Rackmount