fusionstor












Invento i617e Purley Series


Four Hot-Pluggable Systems (nodes) in a 2U form factor.
Each node supports the following:

• Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
• Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM; 16 DIMM slots
• 2 PCI-E 3.0 x16 (LP) slots
• 6 Hot-swap 2.5" SAS/SATA drive bays
• 4 Heavy duty PWM fans
• Up to 2200W Redundant Power Supply Titanium Level (96%)


Processor Support 2 X 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)

Core Logic Intel® C621 chipset

Memory 16x DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM

PCIe Expansion Slot • 2 PCI-E 3.0 x16 Low-profile slots
• 1 SIOM card support

RAID Options SAS:- SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60

Drive Bays • 6 Hot-swap 2.5" SAS/SATA HDD bays

Cooling Feature • 4 Heavy duty PWM fans

RAID support • SAS:- Broadcom 3108 SAS3 (12Gbps) controller; RAID 0, 1, 5, 6, 10, 50, 60 support

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics • ASPEED AST2500 BMC

Onboard I/O SAS:- 6 SAS3 (12Gbps) ports
LAN:- 1 RJ45 Dedicated IPMI LAN port
USB:- 2 USB 3.0 ports (rear)
VGA:- 1 VGA port
Serial Port / Header:- 1 Fast UART 16550 port / 1 Header (internal)

Power Supply Up to 2200W Redundant Power Supply Titanium Level (96%) 80PLUS

Dimension / Form Factor 2U Rackmount