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FusionStor Invento i6224 EPYC Series
Salient Features
1. AI/ML, Deep Learning Training and Inference
2. High-performance Computing (HPC)
3. Cloud Computing
4. Research Laboratory/National Laboratory
5. Autonomous Vehicle Technologies
6. Molecular Dynamics Simulation
7. Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
8. High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
9. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
10. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
11. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN
12. Upto 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
13. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
14. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid)
15. 2x 2200W Platinum Level power supplies with Smart Power Redundancy
1. AI/ML, Deep Learning Training and Inference
2. High-performance Computing (HPC)
3. Cloud Computing
4. Research Laboratory/National Laboratory
5. Autonomous Vehicle Technologies
6. Molecular Dynamics Simulation
7. Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
8. High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
9. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
10. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
11. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN
12. Upto 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
13. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
14. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid)
15. 2x 2200W Platinum Level power supplies with Smart Power Redundancy
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