Salient Features :
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support
5. SAS3 support via Broadcom 3008;IT mode
6. 4 Heavy duty 8cm PWM fans with air shroud
7. 2200W Redundant Power Supplies Titanium Level (96%)