fusionstor












Invento i627 Purley Series


Salient Features :
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support
5. SAS3 support via Broadcom 3008;IT mode
6. 4 Heavy duty 8cm PWM fans with air shroud
7. 2200W Redundant Power Supplies Titanium Level (96%)


Processor Support 2 X Intel® Xeon® Scalable P rocessors, Dual UPI up to 10.4GT/s

Core Logic Intel® C621 chipset

Memory 24x DIMM slots;
Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz

PCIe Expansion Slot • 2 PCI-E 3.0 x16 (LP) slot;
• 1 SIOM card support (flexible networking)
Note: must bundle with Network card

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Drive Bays • 3 Hot-swap 3.5" NVMe/SAS3 drive bays;
• 2 M.2 SATA3 or NVMe support

Networking • 1 RJ45 Dedicated IPMI LAN port

Cooling Feature • 4 Heavy duty 8cm PWM fans with air shroud

Graphics Aspeed AST2500 BMC

Onboard I/O USB:- 2 USB 3.0 ports (rear)
Video:- 1 VGA port
DOM:- 1 DOM (Disk on Module) port

Power Supply 2200W Redundant Power Supplies Titanium Level (96%) 80PLUS

Dimension / Form Factor 2U Rackmount