fusionstor












FusionStor Invento i6307 Series


Salient Features
1. Dual Socket 3rd Gen Intel Xeon Scalable Processor P+ (LGA4189)
2. Up to 2TB RDIMM, DDR4-3200MHz; in 16 DIMM slots
3. 3 x PCIe Gen.4 x16 + 2 x PCIe Gen.4 x8 slots
4. 2 x 1GbE + (1) IPMI (Or 2 x 10GbE + 1 IPMI ports)
6. 8 x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay
7. 3 x 80mm heavy duty fan(s)
8. 600W/800W/1200W/1400W/1600W Redundant Power Supply Platinum/Titanium Level (92%-96%)


Processor Support 2 x LGA4189 3rd Gen. Intel® Xeon® Scalable Processor Max TDP Support up to 270W

Core Logic Intel® C621A chipset

Memory • 16 DIMM slots DDR4 ECC RDIMM/RDIMM 3DS/LRDIMM/ LRDIMM 3DS 3200
• Up to 1,024GB RDIMM/ 2,048GB LRDIMM/ 2,048GB RDIMM 3DS/LRDIMM 3DS
• 8 Channels per CPU
• 1.2V Memory channel

Expansion Slot • PCI-E Slots:-
- 2 Nos. PCI-E Gen4 x8
- 3 Nos. PCI-E Gen4 x16
• M.2:-
- 2 Nos. 22110/2280 (by PCI-E interface)

RAID Options SATA :- Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 (Intel RSTe)

Drive Bays • 8 x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay
• Optional 2 x 2.5" hot-swap SAS3/SATA drive bays
OR
• 12 x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay
• Optional 2 x 2.5" hot-swap SAS3/SATA drive bays

Network Controller • 2 x RJ45 1 Gigabit Ethernet LAN ports
• 1 x RJ45 Dedicated IPMI LAN port

Onboard I/O • USB: 2 Nos. USB3.2 Gen1 ports (rear) + 2 Nos. USB Port Using Header
• Video Output: 1 VGA port(s)
• Serial Port: 1 COM Port(s) (1 header)
• TPM: 1 TPM Header

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
• ASPEED AST2600 BMC

Cooling Features • 3 x 8cm high-performance PWM fan(s)
• 1 x 8cm high-performance PWM fan (optional)

Power Supply • 600W/800W/1200W/1400W/1600W Redundant Power Supply Platinum/Titanium Level (92%-96%)

Dimension / Form Factor • 2U Rackmount