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Fusionstor Invento i6327 Series


Salient Features
1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Up to 8TB DRAM, in 32 DIMM slots
3. 8 PCI-E 4.0 slots
4. 2 USB 3.0 port(s)
5. Flexible networking options
6. ASPEED AST2600 BMC
7. 12 x 3.5" hot-swap hybrid NVMe/SATA/SAS drive bays
8. 1200W redundant Titanium level power supplies(96% Efficiency)

Key Applications
- Virtualization
- HPC
- Cloud Computing
- High End Enterprise Server
- Software Defined Storage
- Application Tier Service Provider
- 5G/Telco


Processor Support 2 x Dual Socket P+ (LGA-4189)3rd Gen Intel® Xeon® Scalable processors Support CPU TDP 270W

Core Logic Intel® C621A chipset

Memory • 32 x DIMM slots;
• Up to 8TB DRAM;
• Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM);
• 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
• Intel® Optane™ Persistent Memory 200 series

Expansion Slot - Slot 1: PCI-E 4.0 x16 FH, 10.5"L
- Slot 2: PCI-E 4.0 x8 FH, 10.5"L
- Slot 3: PCI-E 4.0 x8 Internal LP
- Slot 4: PCI-E 4.0 x16 LP
- Slot 5: PCI-E 4.0 x8 FH, 10.5"L
- Slot 6: PCI-E 4.0 x8 FH, 10.5"L
- Slot 7: PCI-E 4.0 x8 FH, 10.5"L
- Slot 8: PCI-E 4.0 x8 FH, 10.5"L

RAID Options • SATA: SATA3 (6Gbps) via Intel® PCH 621A; RAID 0/1/5/10 support
• NVMe: NVMe (16GT/s); RAID 0/1/5/10 support

Drive Bays • 12x 3.5" hot-swap NVMe/SATA/SAS drive bays (12x 2.5" NVMe hybrid) (SAS/NVMe support requires additional parts)

Network Controller • Flexible networking options
• 1 RJ45 Dedicated BMC LAN port

Onboard I/O • USB: USB 3.0 port(s) (2 rear)
• Video: 1 VGA port(s)
• Serial Port: 1 COM Port(s) (1 rear)
• DOM:2 SuperDOM (Disk on Module) port

Cooling Features - Fans: 4x 8cm heavy duty Hot-swap fans with optimal fan speed control
- Air Shroud: 2 Air Shroud(s)

IPMI • Support for Intelligent Platform Management Interface v.2.0
• IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics ASPEED AST2600 BMC

Power Supply • 1200W redundant Titanium level power supplies(96% Efficiency)

Dimension / Form Factor 2U Rackmount