Invento i632 Purley Series


Salient Features
• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
• 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
• Dual LAN with 10GBase-T with Intel® X722 + X557
• 24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
• 3 x 8cm high-performance PWM fan(s)
• 1200W/1000W Titanium Redundant Power Supply
• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
• 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
• Dual LAN with 10GBase-T with Intel® X722 + X557
• 24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
• 3 x 8cm high-performance PWM fan(s)
• 1200W/1000W Titanium Redundant Power Supply
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