Salient Features
• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
• Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake only)
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• Dual LAN with 10GBase-T with Intel® X722 + X557
• 12 x 5.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
• 3 x 8cm high-performance PWM fan(s)
• 1200W/1000W Titanium Redundant Power Supply