Invento i639 Series


Salient Features
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 8x DIMM slots
3. 1x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 3.0 x4 (in x8 slot), 1x PCI-E 2.0 x4 (in x8 slot)
4. 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 2 x 3.5" fixed drive bay
5. Quad GbE LAN ports via Intel® i350
6. 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
7. 740W Redundant Platinum Power Supply
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 8x DIMM slots
3. 1x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, 1x PCI-E 3.0 x4 (in x8 slot), 1x PCI-E 2.0 x4 (in x8 slot)
4. 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 2 x 3.5" fixed drive bay
5. Quad GbE LAN ports via Intel® i350
6. 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
7. 740W Redundant Platinum Power Supply
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