Salient Features
• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual
Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up
to 2TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake only).
• 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
• Dual LAN with 10Gbase-T from C622
• IPMI2.0, KVM with dedicated LAN
• 8 x 3.5" hot-swap SAS3/SATA drive bay, 2 x 3.5" fixed drive bay
• 800/1000W Redundant Titanium Single Output Power Supply