Invento i643 Purley Series
Salient Features
1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
4. 2 GbE LAN ports
5. M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4, Form Factor: 2242, 2280, Key: M-Key, Double Height Connector
6. 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 2 x 3.5" fixed drive bay
7. 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
8. 740W Redundant Platinum Power Supply
1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
4. 2 GbE LAN ports
5. M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4, Form Factor: 2242, 2280, Key: M-Key, Double Height Connector
6. 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 2 x 3.5" fixed drive bay
7. 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
8. 740W Redundant Platinum Power Supply
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