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Invento i643 Purley Series


Salient Features
1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
4. 2 GbE LAN ports
5. M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4, Form Factor: 2242, 2280, Key: M-Key, Double Height Connector
6. 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards, 2 x 3.5" fixed drive bay
7. 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)
8. 740W Redundant Platinum Power Supply


Processor Support 1 X Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W

Core Logic Intel C621 chipset

Memory 6x DIMM slots;
Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz

PCIe Expansion Slot • 2 PCI-E 3.0 x16 and
• 1 PCI-E 3.0 x8 (in x8)

RAID Options SATA :- Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 8 x 3.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards
• 2 x 3.5" fixed drive bay

Networking 2 x 1GbE LAN ports

Network Controllers Dual LAN with 1GbE with Marvell® 88E1512

Graphics Aspeed AST2500 BMC

Onboard I/O SATA:- 12 SATA3 (6Gbps) port
USB:- 6 USB 2.0 ports (2 rear + 4 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output:- 1 VGA port
Serial Port / Header:- 2 COM Ports (1 rear, 1 header)
TPM:- TPM Header

Cooling Feature • Fans:-
- 3 x 8cm (7000 RPM) hot-swap PWM cooling fan(s)

Power Supply 740W Redundant Platinum Power Supply 80 PLUS (94% Efficiency)

Dimension / Form Factor 2U Rackmountable