Salient Features
• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
• 1 PCI-E 3.0 x32 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot, 1 PCI-E 3.0 x16 for Add-On-Module (AOM)
• Dual LAN with 10Gbase-T from C622
• 3 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, optional 2 x 2.5" hot-swap SAS/SATA drive bay
• 4 x 4cm high-performance counter-rotating PWM fan(s)
• 800W Titanium Redundant Power Supply