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Invento i669 Purley Series

Salient Features
1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
2. Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVM Express x4 Internal Port(s)
4. 8 x 2.5" hot-swap SAS/SATA drive bay, 1 x 5.25" drive bay
5. Dual LAN with GbE from C621
6. 3 x 8cm high-performance PWM fan(s)
7. 720W Redundant Power Supply 80Plus Gold

Specification

Processor Support

2 X Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported

Core Logic

Intel® C621 chipset

Memory

16x DIMM slots;
Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM

PCIe Expansion Slot

• 4 PCI-E 3.0 x16,
• 2 PCI-E 3.0 x8,
• M.2 Interface: PCI-E 3.0 x4,
• M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVM Express x4 Internal Port(s)

RAID Options

Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays

• 8 x 2.5" hot-swap SAS/SATA drive bay,
• 1 x 5.25" drive bay

Networking

• 2 RJ45 Gigabit Ethernet LAN ports

Graphics

ASPEED AST2500 BMC

Onboard I/O

SATA:- 14 SATA3 (6Gbps) port
USB:- 4 USB 2.0 ports (2 rear + 2 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output:- 1 VGA port
Serial Port / Header:- 2 COM Ports (1 rear, 1 header)
TPM:- 1 TPM Header

Power Supply

720W Redundant Power Supply 80 Plus Gold (92% Efficiency)

Dimension / Form Factor

2U Rackmount

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