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Invento i669e Purley Series


Salient Features
• Intel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• Dual LAN with 10GBase-T with Intel® X557
• 8cm 3 x 8cm high-performance PWM fan(s)
• 8 x 2.5" hot-swap SAS/SATA drive bay, 1 x 5.25" drive bay
• 720W Redundant Power Supply 80Plus Gold


Processor Support 2 X Intel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s

Core Logic Intel C622 Chipset

Memory 16x DIMM slots;
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM

PCIe Expansion Slot • PCI-E
- 3 PCI-E 3.0 x16,
- 4 PCI-E 3.0 x8

• M.2:-
- M.2 Interface: 2 PCI-E 3.0 x4
- Form Factor: 2242/2260/2280/22110
- Key: M-Key (RAID 0,1 support)

RAID Options • SATA:- Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 8 x 2.5" hot-swap SAS/SATA drive bay
• 1 x 5.25" drive bay

Network Controllers • Dual LAN with 10GBase-T with Intel® X557

IPMI • Aspeed AST2500

Onboard I/O • SATA:- 10 SATA3 (6Gbps) ports
• LAN:- 2 RJ45 10GBase-T ports
• USB:- 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
• Video Output:- 1 VGA port
• Serial Port / Header:- 1 COM Port (1 rear)
• TPM:- 1 TPM Header

Cooling Feature • 3 x 8cm high-performance PWM fan(s)

Power Supply 720W Redundant Power Supply 80Plus Gold (92% efficiency)

Dimension / Form Factor 2U Rackmount