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Invento i700 Purley Series

Salient Features
• Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
• Dual LAN with GbE from C621 Support 1000BASE-T
• 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
• 7.1 HD Audio
• 3x Middle 8cm (5000 rpm) PWM Fans & 2x 8cm (5000 rpm) PWM Fans
• 1200W Redundant Gold Level Certified High-Efficiency Power Supply

Specification

Processor Support

2 X Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s

Core Logic

Intel® C621 chipset

Memory

• 16x DIMM slots
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM

PCIe Expansion Slot

• PCI-E
- 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8

• M.2:-
- M.2 Interface: PCI-E 3.0 x4
- Form Factor: 2260, 2280, 22110
- Key: M-Key

RAID Options

• SATA :- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays

• 3x 5.25" External HDD Drive Bays &
• 8x 3.5" Hot-Swappable HDD Drives

Cooling Feature

• 3x Middle 8cm (5000 rpm) PWM Fans & 2x 8cm (5000 rpm) PWM Fans

Network Controllers

• Dual LAN with GbE from C621 Support 1000BASE-T

Graphics

• Aspeed AST2500 BMC

Onboard I/O

• USB:- 4 USB 3.0 ports (4 rear), 2 USB 3.1 ports (2 rears)
• Video Output:- 1 VGA port
• Serial Port / Header:- 1 COM Port (1 header)
• TPM:- 1 TPM Header

Power Supply

1200W Redundant Gold Level Certified High-Efficiency Power Supply (92% efficiency)

Dimension / Form Factor

4U/Tower

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