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FusionStor Invento i709e Purley


Salient Features
• Intel 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
• Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only).
• 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
• 6 x 3.5" fixed drive bay and 4 x 2.5" fixed drive bay
• Dual LAN with GbE from C621
• 2 x 12cm front cooling fan(s)
• 750W 80PLUS Gold Fully-Modular Power Supply


Processor Support 1 X Intel 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s

Core Logic Intel C621 Chipset

Memory • 16 x DIMM slots;
• Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots; Up to 2TB Intel® Optane DC Persistent Memory in memory mode (Cascade Lake only).

PCIe Expansion Slot • PCI-E:-
- 4 PCI-E 3.0 x16
- 2 PCI-E 3.0 x8

• M.2:-
- M.2 Interface: PCI-E 3.0 x4
- Form Factor: 2260, 2280, 22110
- Key: M-Key

RAID Options • SATA :- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 6 x 3.5" fixed drive bay and
• 4 x 2.5" fixed drive bay

Network Controllers • Dual LAN with GbE from C621

Graphics • Aspeed AST2500 BMC


Onboard I/O • USB:- 4 USB 3.0 ports (4 rear)2 USB 3.1 ports (2 rear)
• Video Output:- 1 VGA port
• Serial Port / Header:- 1 COM Port (1 header)
• TPM:- 1 TPM Header

Cooling Feature • 2 x 12cm front cooling fan(s)
• 1 x 12cm rear exhaust fan(s)

Power Supply 750W 80PLUS Gold Fully-Modular Power Supply

Dimension / Form Factor Mid-Tower