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Invento i717 Series

Salient Features
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600v4/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 16x DIMM slots
3. 3x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, and 1x PCI-E 2.0 x4 (in x8) slot
4. Dual GbE LAN ports via Intel® i210
5. 7.1 HD Audio with optical S/PDIF
6. Thunderbolt Add-On Card support
7. 2x 5.25" External HDD Drive Bays & 4x 3.5" HDD Drive Bays
8. 1x 12cm Rear (4000 rpm) PWM Fan & 1x 9cm Front (4200 rpm) PWM Fan
9. 668W Platinum Level Certified High-Efficiency Power Supply

Specification

Processor Support

2 X Intel® Xeon® processor E5- 2600v4/ v3 family; QPI up to 9.6GT/s

Core Logic

Intel® C612 chipset

Memory

16x DIMM slots;
Up to 2TB ECC 3DS LRDIMM, up to DDR4- 2400MHz

PCIe Expansion Slot

• 3x PCI-E 3.0 x16,
• 2x PCI-E 3.0 x8, and
• 1x PCI-E 2.0 x4 (in x8) slot

RAID Options

AHCI SATA:- SATA3 (6Gbps); RAID 0, 1, 5, 10
SCU SATA:- SATA3 (6Gbps); RAID 0, 1, 5, 10

Drive Bays

• 24 2x 5.25" External HDD Drive Bays &
• 4x 3.5" HDD Drive Bays

Networking

• Dual GbE LAN ports via Intel® i210

Cooling feature

• 1x 12cm Rear (4000 rpm) PWM Fan &
• 1x 9cm Front (4200 rpm) PWM Fan

Onboard I/O

SATA:- 10x SATA3 (6Gbps) ports
USB:- 6x USB 3.0 ports (4 rear + 2 via header), 5x USB 2.0 ports (2 rear + 2 via header + 1 Type A)
Audio:- 7.1 HD Audio with optical S/PDIF
DOM:- 2x DOM (Disk on Module) ports
TPM:- 1x TPM Header

Power Supply

668W Platinum Level Certified High-Efficiency Power Supply 80PLUS (92% efficiency)

Dimension / Form Factor

Mid-Tower

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