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Invento i717e Purley Series

Salient Features
1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 2 UPI up to 10.4 GT/s
2. Up to 4TB 3DS ECC LRDIMM, DDR4-2666MHz; in 16 DIMM slots
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
4. Dual LAN with GbE from C621
5. 2 x 2800 RPM fan(s), 1 x 2700 RPM fan(s)
6. 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
7. 865W 80PLUS Certified High-Efficiency Power Supply

Specification

Processor Support

2 X 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP),Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 2 UPI up to 10.4 GT/s

Core Logic

Intel® C621 chipset

Memory

• 16x DIMM slots
• Up to 4TB 3DS ECC LRDIMM, DDR4-2666MHz;

PCIe Expansion Slot

• PCI-E:
- 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8

• M.2:
- M.2 Interface: PCI-E 3.0 x4
- Form Factor: 2260, 2280, 22110
- Key: M-Key

RAID Options

SATA :- Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays

• 3x 5.25" External HDD Drive Bays &
• 8x 3.5" Hot-Swappable HDD Drives

Networking

• Dual LAN with GbE from C621

Cooling feature

• 2 x 2800 RPM fan(s)
• 1 x 2700 RPM fan(s)

Graphics

• Aspeed AST2500 BMC

Onboard I/O

• USB:- 4 USB 3.0 ports (4 rear)2 USB 3.1 ports (2 rears)
• Video Output:- 1 VGA port
• Serial Port / Header:- 1 COM Port (1 header)
• Audio:- 7.1 HD Audio
• TPM:- 1 TPM Header

Power Supply

865W 80PLUS Certified High-Efficiency Power Supply (88% Efficiency)

Dimension / Form Factor

Tower/ 4U Rack Mountable

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