Salient Features
1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
2. Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVMExpress x4 Internal Port(s)
4. Dual LAN with GbE from C621
5. 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
6. 800W hot swap redundant power supply