Invento i722e Purley Series
Salient Features
1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
4. Dual GbE LAN ports
5. 3 x 8cm hot-swap redundant PWM cooling fan(s)
6. IPMI2.0 , KVM with dedicated LAN
7. 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
8. 920W Redundant Platinum Level Certified High-Efficiency Power Supply
1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots; Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
4. Dual GbE LAN ports
5. 3 x 8cm hot-swap redundant PWM cooling fan(s)
6. IPMI2.0 , KVM with dedicated LAN
7. 3x 5.25" External HDD Drive Bays & 8x 3.5" Hot-Swappable HDD Drives
8. 920W Redundant Platinum Level Certified High-Efficiency Power Supply
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