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Invento i727e Series


Salient Features
1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4- 2400MHz; 16x DIMM slots
3. 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot
4. Dual GbE LAN ports via Intel® i210
5. 7.1 HD Audio with optical S/PDIF
6. 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
7. 1 x 12cm rear exhaust fan(s), Optional 1 x 12cm (front) cooling fan
8. 865W Silver Level Certified High-Efficiency Power Supply


Processor Support 2 X Intel® Xeon® processor E5- 2600 v4/ v3 family; QPI up to 9.6GT/s

Core Logic Intel C612 chipset

Memory 16x DIMM slots;
Up to 2TB ECC 3DS LRDIMM, up to DDR4- 2400MHz

PCIe Expansion Slot • 3 PCI-E 3.0 x16
• 2 PCI-E 3.0 x8
• 1 PCI-E 2.0 x4 (in x8)

RAID options • AHCI SATA:-
- SATA3 (6Gbps); RAID 0, 1, 5, 10
• SCU SATA
- SATA3 (6Gbps); RAID 0, 1, 5, 10
• SAS
- Broadcom 3008 SAS3 (12Gbps) controller; SW RAID 0, 1, 10

Drive Bays • 4 x 3.5" fixed drive bay (Optional 4 x 2.5" fixed drive bay)
• 2 x standard 5.25" drive bay
• 1 x 3.5" internal fixed drive bay


Networking 2x RJ45 Gigabit Ethernet LAN ports

Onboard I/O SATA:- 10x SATA3 (6Gbps) ports
SAS:- 8x SAS3 (12Gbps) ports
USB:- 6x USB 3.0 ports (4 rear + 2 via header), 5x USB 2.0 ports (2rear + 2 via header + 1 Type A)
Audio:- 7.1 HD Audio with optical S/PDIF
DOM:- 2x DOM (Disk on Module) ports
TPM:- 1x TPM Header

Cooling Feature • Fans:-
- 1 x 12cm rear exhaust fan(s)
- Optional 1 x 12cm (front) cooling fan


Power Supply 865W Silver Level Certified High-Efficiency Power Supply (80PLUS)


Dimension / Form Factor Mid Tower