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FusionStor Invento i7322 Purley
Salient Features
• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
• 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
• 4x 3.5" Internal HDD Drive Bays
• 2 x 1GbE LAN ports
• 1 x Rear 12cm (1850 RPM) PWM Fan
• 1200W Platinum Level Certified High-Efficiency Power Supply
1 X 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
Core Logic
Intel C621 Chipset
Memory
• 8 x DIMM slots;
• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
• Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
PCIe Expansion Slot
• PCI-E:-
- 2 PCI-E 3.0 x8 (in x16 slot),
- 4 PCI-E 3.0 x8,
- 1 PCI-E 3.0 x4 (in x8 slot) • M.2:-
- M.2 Interface: PCI-E 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- Double Height Connector
RAID Options
• SATA :- Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Drive Bays
• 4 x 3.5" fixed drive bay
• Optional 4 x 2.5" fixed drive bay
Network Controllers
• Dual LAN with 1GbE with Intel® I210
Graphics
• Aspeed AST2500 BMC
Onboard I/O
• SATA: 8 SATA3 (6Gbps) port
• USB: 8 USB 2.0 ports (2 rear + 6 via headers), 5 USB 3.2 Gen1 ports (2 rear + 2 via headers + 1 Type A)
• Video Output: 1 VGA port
• Serial Port / Header: 2 COM Ports (1 rear, 1 header)
• TPM: TPM Header
Cooling Feature
• 1 x 12cm rear exhaust fan(s)
• Optional 1 x 12cm (front) cooling fan
Power Supply
1200W Platinum Level Certified High-Efficiency Power Supply (93% Efficiency)