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Invento i732e Series


Salient Features
1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3, E5-1600 v4/ v3, Core i7
2. Up to 512GB ECC DDR4 2400MHz LRDIMM or 128GB ECC/non-ECC UDIMM (available with Core i7 only); 8x DIMM slots
3. 4 PCI-E 3.0 x16 (run at 16/16/NA/8 or 16/8/8/8), 2 PCI-E 2.0 x1 (in x4)
4. Intel® i210-AT Dual port GbE LAN
5. 2 x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
6. 1 x 12cm rear exhaust fan(s), Optional 1 x 12cm (front) cooling fan
7. 500W Bronze Level Certified High-Efficiency Power Supply


Processor Support 1 X Intel® Xeon® processor E5- 2600 v4/ v3, E5-1600 v4/ v3, Core i7

Core Logic Intel C612 chipset

Memory 8x DIMM slots;
Up to 512GB ECC DDR4 2400MHz LRDIMM or 128GB ECC/non-ECC UDIMM (available with Core i7 only)

PCIe Expansion Slot • 4 PCI-E 3.0 x16 (run at 16/16/NA/8 or 16/8/8/8),
• 2 PCI-E 2.0 x1 (in x4)

RAID options • SATA :- SATA3 (6Gbps) via C612 controller; RAID 0, 1, 5, 10 support

Drive Bays • 2 x 5.25" External HDD Drive Bays &
• 4x 3.5" Internal HDD Drive Bays


Networking • 2x RJ45 Gigabit Ethernet LAN ports

Onboard I/O SATA:- 10x SATA3 (6Gbps) ports
USB:- 8x USB 3.0 ports (6 rear + 2 via header), 4 of 8 USB 3.0 ports
upgradable to 4x USB 3.1 (10Gbps) (2 rear + 2 via header) (This upgrade is BOM option for OEM only)
Audio:- HD Audio 7.1 channel connector by Realtek ALC1150
Keyboard/Mouse:- 1 PS/2 Keyboard/Mouse port
Serial Port / Header:- 1x header
TPM:- 1x TPM Header

Cooling Feature • Fans:-
- 1 x 12cm rear exhaust fan(s)
- Optional 1 x 12cm (front) cooling fan


Power Supply 500W Bronze Level Certified High-Efficiency Power Supply 80 PLUS


Dimension / Form Factor Mid-Tower