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Invento i732 Purley Series


Salient Features
1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
2. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
3. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
4. 2 GbE LAN ports
5. 1 x 12cm rear exhaust fan(s); Optional 1 x 12cm (front) cooling fan
6. 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
7. 900W Gold Level Certified High-Efficiency Power Supply


Processor Support 1 X Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W

Core Logic Intel® C621

Memory 6x DIMM slots;
Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz

PCIe Expansion Slot • PCI-E:- 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
• M.2:- M.2 Interface: PCI-E 3.0 x4, Form Factor: 2242, 2280, Key: MKey, Double Height Connector

RAID Options SATA:- Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 2x 5.25" External HDD Drive Bays &
• 4x 3.5" Internal HDD Drive Bays

Network Controllers Dual LAN with 1GbE with Marvell® 88E1512

Graphics Aspeed AST2500 BMC

Onboard I/O SATA:- 12 SATA3 (6Gbps) port
LAN:- 2 1GbE LAN ports
USB:- 6 USB 2.0 ports (2 rear + 4 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output:- 1 VGA port
Serial Port / Header:- 2 COM Ports (1 rear, 1 header)
TPM:- TPM Header

Power Supply 900W Gold Level Certified High-Efficiency Power Supply 80 PLUS (90% efficiency)

Dimension / Form Factor Mid-Tower