Invento i743 Purley Series
Salient Features
1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
2. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110,
M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
4. Dual LAN with GbE from C621 Support 1000BASE-T
5. 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
6. 1 x 12cm rear exhaust fan(s), Optional 1 x 12cm (front) cooling fan
7. 1200W Platinum Level Certified High-Efficiency Power Supply
1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
2. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110,
M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
4. Dual LAN with GbE from C621 Support 1000BASE-T
5. 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
6. 1 x 12cm rear exhaust fan(s), Optional 1 x 12cm (front) cooling fan
7. 1200W Platinum Level Certified High-Efficiency Power Supply
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