Invento i744 Purley Series


Salient Features
• Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8
• 2 RJ45 10GBase-T ports
• 1x Rear 12cm (1850 RPM) PWM Fan
• 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
• 1200W Platinum Level Certified High-Efficiency Power Supply
• Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
• Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
• 3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8
• 2 RJ45 10GBase-T ports
• 1x Rear 12cm (1850 RPM) PWM Fan
• 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
• 1200W Platinum Level Certified High-Efficiency Power Supply
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