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FusionStor Invento i755


Salient Features
1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W
2. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
4. 6 USB 3.0 ports (4 rear + 2 front)
5. 750W Multi-output Power Supply (80PLUS GOLD)
6. Development Box
7. Financial Analysis
8. Oil and Gas Simulation
9. Code Optimization


Processor Support 1 x Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W

Core Logic Intel® C612 chipset

Memory 6 DIMM slots;
Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz

PCIe Expansion Slot 2 PCI-E 3.0 x16,
1 PCI-E 3.0 x4

RAID Options • SATA3 (6Gbps) via C612 controller
• RAID 0, 1, 5, 10 support

Drive Bays 6x 3.5" and 4x 2.5" tool-less drive bays,
2x 5.25" peripheral bays

Networking • 2 RJ45 Gigabit Ethernet LAN ports
• 1 Dedicated IPMI LAN port

Onboard I/O SATA:- 10 SATA3 (6Gbps) ports
USB:- 6 USB 3.0 ports (4 rear + 2 front)
Display:- 1 VGA port
COM Port/Header:- 1 COM Port (header)

Power Supply 750W Multi-output Power Supply (80PLUS GOLD)

Dimension / Form Factor Mid-Tower
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