FusionStor Invento i755


Salient Features
1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W
2. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
4. 6 USB 3.0 ports (4 rear + 2 front)
5. 750W Multi-output Power Supply (80PLUS GOLD)
6. Development Box
7. Financial Analysis
8. Oil and Gas Simulation
9. Code Optimization
1. Single socket P (LGA 3647) supports Intel® Xeon® Phi™ x200 processor, CPU TDP support Up to 260W
2. Up to 384GB ECC LRDIMM, 192GB ECC RDIMM, DDR4-2400MHz in 6 DIMM slots
3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x4
4. 6 USB 3.0 ports (4 rear + 2 front)
5. 750W Multi-output Power Supply (80PLUS GOLD)
6. Development Box
7. Financial Analysis
8. Oil and Gas Simulation
9. Code Optimization
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|