Invento i774 Purley Series


Salient Features
• Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
• Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
• 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
• 2 GbE LAN ports
• M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key Double Height Connector
• 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
• 500W Redundant Power Supply
• Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
• Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
• 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
• 2 GbE LAN ports
• M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key Double Height Connector
• 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
• 500W Redundant Power Supply
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|
||
|