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Invento i774 Purley Series


Salient Features
• Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
• Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
• 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
• 2 GbE LAN ports
• M.2 NGFF connector M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key Double Height Connector
• 2x 5.25" External HDD Drive Bays & 4x 3.5" Internal HDD Drive Bays
• 500W Redundant Power Supply


Processor Support 1 X Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647)supported, CPU TDP support 165W

Core Logic Intel® C621 chipset

Memory 8 x DIMM slots;
Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz

PCIe Expansion Slot • 2 PCI-E 3.0 x8 (in x16),
• 4 PCI-E 3.0 x8 and
• 1 PCI-E 3.0 x4 (in x8)

RAID options SATA :- Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

Drive Bays • 2x 5.25" External HDD Drive Bays &
• 4x 3.5" Internal HDD Drive Bays

Network Controller • Dual LAN with 1GbE with Intel® I210

Cooling Feature • 1 x 12cm rear exhaust fan(s)
• Optional 1 x 12cm (front) cooling fan

Graphics • Aspeed AST2500 BMC

Onboard I/O SATA:- 8 SATA3 (6Gbps) port
LAN:- 2 RJ45 Gigabit Ethernet LAN ports
USB:- 8 USB 2.0 ports (2 rear + 6 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output:- 1 VGA port
Serial Port / Header:- 2 COM Ports (1 rear, 1 header)
TPM:- TPM Header

Power Supply 500W Redundant Power Supply 80PLUS Bronze Level

Dimension / Form Factor 4U/ Tower