Invento i816 Purley Series
Salient Features
1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. Broadcom 3108 SAS3 AOC
5. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557
6. 16 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays
7. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
8. 1200W Redundant Power Supplies Titanium Level (96%)
1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port)
4. Broadcom 3108 SAS3 AOC
5. 2x 10GBase-T LAN ports with Intel X722 + PHY Intel X557
6. 16 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays
7. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans
8. 1200W Redundant Power Supplies Titanium Level (96%)
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