Salient Features
1. Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
2. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3. 2 PCI-E 3.0 x16, 8 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0
x4 (in x8 slot) M.2 Interface: 1 PCI-E 3.0 x4, M.2 Form Factor: 2280, 22110
4. Dual LAN with Intel® X550 10GBase-T Ethernet Controller
5. 24 x 3.5" hot-swap drive bay
6. 4 x 92x38mm Hot-Swap Cooling Fans, 1 x 8cm hot-swap exhaust fan(s) & air shroud
7. 1200W/1000W Titanium Power Supply