Invento i616e Purley Series

i616e

Invento i616e Purley Series

Salient Features
Four hot-pluggable systems (nodes) in a 2U form factor. Specification of Each node supports the following:
  • Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
  • Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane™ DCPMM; 24 DIMM slots
  • 1 PCI-E 3.0 (x16) Low-profile slot; 1 SIOM card support
  • 6 Hot-swap 2.5" SAS3 drive bays or 4 NVMe + 2 SAS3 Hot-swap 2.5"
  • 4 Heavy duty PWM fans
  • 2200W Redundant Power Supplies Titanium Level (96%)

Specification

Model i616e
Processor Support 2 X 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
Core Logic Intel® C621 chipset
Memory
  • 24 x DIMM slots
  • Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
PCIe Expansion Slot
  • 1 PCI-E 3.0 (x16) Low-profile slot
  • 1 SIOM card support (must bundle with network card)
RAID Options SAS: SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
Drive Bays
  • Hot Swap: 6 Hot-swap 2.5" SAS3 drive bays or 4 NVMe + 2 SAS3 Hot-swap 2.5"
  • M.2: 2 M.2 NVMe or SATA (2240/2260/2280) via optional Add on card
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Cooling Feature 4 Heavy duty PWM fans with air shroud
Onboard I/O
  • LAN: 1 RJ45 Dedicated IPMI LAN port
  • USB: 2 USB 3.0 ports (rear)
  • Video: 1 VGA port
  • DOM: 1 DOM (Disk on Module) port
Power Supply 2200W Redundant Power Supplies Titanium Level (96%) 80PLUS
Dimension / Form Factor 2U Rackmount