Invento i617 Purley Series

i617

Invento i617 Purley Series

Salient Features
Used for Compute Intensive Application, HPC, Data Center, Enterprise Server, Financial Analysis, Missioncritical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots
  • 6 Hot-swap 2.5" SATA3 drive bays
  • 4 Heavy duty 8cm PWM fans with optimal fan speed control
  • 2200W Redundant Power Supply

Specification

Model i617
Processor Support 2 X Intel® Xeon® Scalable Proc essors, Dual UPI up to 10.4GT/s
Core Logic Intel® C621 chipset
Memory
  • 16 x DIMM slots;
  • Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz
PCIe Expansion Slot 2 PCI-E 3.0 x16 (LP) slots
RAID Options SATA3 (6Gbps); RAID 0, 1, 5, 10 support
Drive Bays 6 Hot-swap 2.5" SATA3 drive bays
Networking 1 RJ45 Dedicated IPMI LAN port
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2500 BMC
Onboard I/O
  • SATA: 6 SATA3 (6Gbps) ports
  • USB: 2 USB 3.0 ports (rear)
  • VGA: 1 VGA port
  • Serial Port / Header: 1 Fast UART 16550 port / 1 Header (internal)
  • Others: 2 DOM support on the motherboard
Power Supply 2200W Redundant Power Supply 80PLUS Titanium level
Dimension / Form Factor 2U Rackmount