Invento i617e Purley Series

i617e

Invento i617e Purley Series

Salient Features

Four Hot-Pluggable Systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual Socket P (LGA 3647) support 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
  • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM; 16 DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots
  • 6 Hot-swap 2.5" SAS/SATA drive bays
  • 4 Heavy duty PWM fans
  • Up to 2200W Redundant Power Supply Titanium Level (96%)

Specification

Model i617e
Processor Support 2 X 2nd Gen. Intel Xeon Scalable processors (Cascade Lake/Skylake)
Core Logic Intel® C621 chipset
Memory
  • 16 x DIMM slots;
  • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel Optane DCPMM
PCIe Expansion Slot
  • 2 PCI-E 3.0 x16 Low-profile slots
  • 1 SIOM card support
RAID Options SAS: SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
Drive Bays 6 Hot-swap 2.5" SAS/SATA HDD bays
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics ASPEED AST2500 BMC
Cooling Feature 4 Heavy duty PWM fans
Onboard I/O
  • SAS: 6 SAS3 (12Gbps) ports
  • LAN: 1 RJ45 Dedicated IPMI LAN port
  • USB: 2 USB 3.0 ports (rear)
  • VGA: 1 VGA port
  • Serial Port / Header: 1 Fast UART 16550 port / 1 Header (internal)
Power Supply Up to 2200W Redundant Power Supply Titanium Level (96%) 80PLUS
Dimension / Form Factor 2U Rackmount