Invento i627 Purley Series

i627

Invento i627 Purley Series

Salient Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s
  • Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  • 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support
  • SAS3 support via Broadcom 3008;IT mode
  • 4 Heavy duty 8cm PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level (96%)

Specification

Model i627
Processor Support 2 X Intel® Xeon® Scalable P rocessors, Dual UPI up to 10.4GT/s
Core Logic Intel® C621 chipset
Memory
  • 24x DIMM slots;
  • Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz
PCIe Expansion Slot
  • 2 PCI-E 3.0 x16 (LP) slot;
  • 1 SIOM card support (flexible networking)
Note: must bundle with Network card
Drive Bays
  • 3 Hot-swap 3.5" NVMe/SAS3 drive bays;
  • 2 M.2 SATA3 or NVMe support
Networking 1 RJ45 Dedicated IPMI LAN port
Cooling Feature 4 Heavy duty 8cm PWM fans with air shroud
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics ASPEED AST2500 BMC
Onboard I/O
  • USB: 2 USB 3.0 ports (rear)
  • Video: 1 VGA port
  • DOM: 1 DOM (Disk on Module) port
Power Supply 2200W Redundant Power Supplies Titanium Level (96%) 80PLUS
Dimension / Form Factor 2U Rackmount