Invento i6307 Series

Dual Socket 3rd Gen Intel Xeon Scalable Processor P+ (LGA4189)
Up to 2TB RDIMM, DDR4-3200MHz; in 16 DIMM slots
3 x PCIe Gen.4 x16 + 2 x PCIe Gen.4 x8 slots
2 x 1GbE + (1) IPMI (Or 2 x 10GbE + 1 IPMI ports)
8 x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay
3 x 80mm heavy duty fan(s)
600W/800W/1200W/1400W/1600W Redundant Power Supply Platinum/Titanium Level (92%-96%)

Model	i6307
Processor Support	2 x LGA4189 3rd Gen. Intel® Xeon® Scalable Processor Max TDP Support up to 270W
Core Logic	Intel® C621A chipset
Memory	16 DIMM slots DDR4 ECC RDIMM/RDIMM 3DS/LRDIMM/ LRDIMM 3DS 3200 Up to 1,024GB RDIMM/ 2,048GB LRDIMM/ 2,048GB RDIMM 3DS/LRDIMM 3DS 8 Channels per CPU 1.2V Memory channel
PCIe Expansion Slot	PCI-E Slots 2 Nos. PCI-E Gen4 x8 3 Nos. PCI-E Gen4 x16 M.2 2 Nos. 22110/2280 (by PCI-E interface)
RAID Options	SATA: Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 (Intel RSTe)
Drive Bays	8 x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay Optional 2 x 2.5" hot-swap SAS3/SATA drive bays OR 12 x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive bay Optional 2 x 2.5" hot-swap SAS3/SATA drive bays
Network Controllers	2 x RJ45 1 Gigabit Ethernet LAN ports 1 x RJ45 Dedicated IPMI LAN port
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2600 BMC
Cooling Features	3 x 8cm high-performance PWM fan(s) 1 x 8cm high-performance PWM fan (optional)
Onboard I/O	USB: 2 Nos. USB3.2 Gen1 ports (rear) + 2 Nos. USB Port Using Header Video Output: 1 VGA port(s) Serial Port: 1 COM Port(s) (1 header) TPM: 1 TPM Header
Power Supply	600W/800W/1200W/1400W/1600W Redundant Power Supply Platinum/Titanium Level (92%-96%)
Dimension / Form Factor	2U Rackmount