Invento i6312 Series

3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A chipset
Up to DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
Dual LAN with Intel® i210 Gigabit Ethernet Controller
8x 3.5"(tool-less) or 2.5"(screw) hot-swap SAS3/SATA drive bay
3 x 80mm heavy duty fan(s)
2 x 600W / 650W / 800W Redundant Power Supply Platinum Level (92-94%)

Model	i6312
Processor Support	1 x 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Core Logic	Intel® C621A chipset
Memory	8 DIMM slots Supports 3DS ECC LRDIMM, DDR4-3200MHz; Up to 3DS ECC RDIMM, DDR4-3200MHz
PCIe Expansion Slot	PCI-E Slots 4 PCIe4.0 x16, 3 PCIe4.0 x8 M.2 M.2 Interface: 2 SATA/PCI-E 3.0 x4 Form Factor: 2280/22110 Key: M-Key
RAID Options	SATA: Intel® C621A controller for 13 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Drive Bays	8 x 3.5" (tool-less) or 2.5" (screw) hot-swap SAS3/SATA drive baya Optional 2 x 3.5" fixed drive bays
Networking	2 Nos. RJ45 Gigabit Ethernet LAN ports 1 RJ45 Dedicated IPMI LAN port
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2600 BMC
Cooling Features	3 x 80mm heavy duty fan(s) with PWM fan(s) speed control
Onboard I/O	SATA: 13 SATA3 (6Gbps) port(s) USB: 4 USB 2.0 port(s) (4 via header; 2 rear) Video Output: 1 VGA port(s) TPM: 1 TPM Header
Power Supply	2 x 600W / 650W /800W Redundant Power Supply Platinum Level (94%)
Dimension / Form Factor	2U Rackmount