Invento i6316 Series

Scientific Virtualization
High Performance Computing
VDI
AI/Deep Learning Training
Supports up to 6 GPUs
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors, Support CPU TDP 270W
Up to 4TB ECC LRDIMM, up to DDR4-3200/2933/2666; 16 DIMM slots
2 PCI-E Gen 4.0 x8 LP, 6 PCI-E Gen 4.0 x16 FHFL
Flexible networking options
10 x 2.5" Hot-swap drive bays
5 heavy duty fans with optimal fan speed control
2600W (1+1) Titanium Redundant Power Supply (96%)

Model	i6316
Processor Support	2 X 3rd Gen Intel® Xeon® Scalable Processors, Support CPU TDP 270W
Core Logic	Intel® C621A chipset
Memory	16x DIMM slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM/RDIMM; Intel® Optane™ Persistent Memory 200 series
PCIe Expansion Slot	2 PCI-E Gen 4.0 x8 LP 6 PCI-E Gen 4.0 x16 FHFL M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280/22110
RAID Options	SATA3 (6Gbps); RAID 0/1/5/10 support
Drive Bays	10x 2.5" Hot-swap drive bays 2 M.2 NVMe for boot drive only Up to 6x 2.5" NVMe
Networking	1 RJ45 Dedicated IPMI LAN port
Cooling Features	5 counter rotating fans w/ Optimal Fan Speed Control
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics	ASPEED AST2600 BMC
Power configurations	ACPI Power Management Power-on mode for AC power recovery
Onboard I/O	USB: 2 USB 3.2 Gen2 port(s) (2 rear) Video: 1 VGA port Serial Port: 1 COM Port(s) (1 rear) TPM: 1 TPM Header
Power Supply	2600W (1+1) Titanium Redundant Power Supply (96%)
Dimension / Form Factor	2U Rackmount