Invento i632 Purley Series

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
Dual LAN with 10GBase-T with Intel® X722 + X557
24 x 2.5" hot-swap SAS/SATA drive bay, optional 2 x 2.5" hot-swap drive bay
3 x 8cm high-performance PWM fan(s)
1200W/1000W Titanium Redundant Power Supply

Model	i632
Processor Support	2 X 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Core Logic	Intel® C622 Chipset
Memory	16 x DIMM slots; Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
PCIe Expansion Slot	PCI-E: 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2: M.2 Interface: PCI-E 3.0 x 4 Form Factor: 2260, 2280, 22110 Key: M-Key
RAID Options	SATA: Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10
Drive Bays	24 x 2.5" hot-swap SAS/SATA drive bay Optional 2 x 2.5" hot-swap drive bay
Networking	Dual LAN with 10GBase-T with Intel® X722 + X557
IPMI	IPMI 2.0 KVM with dedicated LAN ASPEED AST2500
Cooling Feature	3 x 8cm high-performance PWM fan(s) Optional 5 x 6cm 4pin high performance fan(s)
Onboard I/O	SATA: 14 SATA3 (6Gbps) port USB: 4 USB 2.0 ports (2 rear + 2 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A) Video Output: 1 VGA port Serial Port / Header: 2 COM Ports (1 rear, 1 header) TPM: 1 TPM Header
Power Supply	1200W/1000W Titanium Redundant Power Supply 80PLUS (96% Efficiency)
Dimension / Form Factor	2U Rackmount