Invento i6325G Series

Single or Dual Socket 3rd generation Intel® Xeon® ICE Lake scalable full range of processors, TDP 270W
Supports 2400/2666/2933/3200MHz memory frequency support, 32 DIMM Slots
Up to 7 nos. PCIe 4.0 Expansion Slot
Onboard 2 x 10GbE (RJ45) Ports
Supports up to 25 x 2.5″ SAS/SATA/SSD hard drives
4 Nos. Hot Plug fans with speed and cooling zone control
ASPEED AST2500 onboard Graphics
Internal storage: 2 x PCIe 4.0 x4 M.2 slots slots
Platinum level 1200W Hot-Swappable Redundant Power Supply

Model	i6325G
Processor Support	Single or Dual Socket 3rd generation Intel® Xeon® ICE Lake scalable full range of processors, TDP 270W
Core Logic	Intel® C621A Chipset
Memory	32 x DIMM slots; Support DDR4 ECC RDIMM/LRDIMM server memory, memory frequency supports 1866/2133/2400/2666/2933/3200MHz Supports Intel® Optane DCPMM Memory
Expansion Slot	Up to 7 Nos. PCIe 4.0 Expansion Slots
RAID Options	SATA: SATA3 (6Gbps); RAID 0, 1, 5, 10
Drive Bays	Supports up to 25 x 2.5″ SAS/SATA/SSD hard drives The rear PCIe can be replaced with a maximum of 6 hard disk bays, and 2U8 bays can be built in 2 x 2.5″ SSDs
Network Controllers	2 x 10GbE (RJ45) Ethernet Ports 1 RJ45 Dedicated IPMI LAN port
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC
Cooling Features	4 Nos. fans with speed and cooling zone control
Onboard I/O	USB: 2 USB 3.0 ports (Front), 2 USB 3.0 ports (Rear) Video: 2 VGA Ports (Front & Rear) Serial Port / Header:1 COM Port
Environmental Spec.	Operating Temperature: 10ºC - 35ºC (without direct sunlight); extended operating temperature: 5ºC - 40ºC (limited configurations are met); transport storage temperature: -40ºC - 70ºC Humidity: Operating humidity: 30% - 80% (non-condensing); Storage humidity: 5% - 95% (non-condensing)
Power Supply	Platinum level 1200W (1+1) Hot-Swappable Redundant Power Supply
Dimension / Form Factor	2U Rackmount