Invento i636 Purley Series

i636

Invento i636 Purley Series

Salient Features
  • Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported
  • Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
  • 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
  • Dual LAN with 1GbE with Marvell® 88E1512
  • 12 x 3.5" hot-swap SAS/SATA drive bay with SES3, optional 2 x 2.5" hot-swap drive bay
  • 3 High-performance fan(s)
  • 1200W Redundant Power Supplies Titanium Level (96%)

Specification

Model i636
Processor Support 2 X Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Core Logic Intel® C621 Chipset
Memory
  • 16 x DIMM slots;
  • Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM
PCIe Expansion Slot
  • 3 PCI-E 3.0 x16
  • 4 PCI-E 3.0 x8
  • M.2 Interface: 2 PCI-E 3.0 x4, M.2 Form Factor: 2242/2260/2280/22110,M.2 Key: M-Key (RAID 0,1 support)
RAID Options SATA: Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10
Drive Bays
  • 12 x 3.5" hot-swap SAS/SATA drive bay with SES3
  • Optional 2 x 2.5" hot-swap drive bay
Cooling Feature Fans: 3 x 8cm high-performance PWM fan(s)
Networking Dual LAN with 1GbE with Marvell® 88E1512
Graphics ASPEED AST2500
Onboard I/O
  • SATA: 10 SATA3 (6Gbps) ports
  • LAN: 2 1GbE LAN ports
  • USB: 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
  • Video Output: 1 VGA port
  • Serial Port / Header: 1 COM Port (1 rear)
  • TPM: 1 TPM Header
Power Supply 1200W Redundant Power Supplies Titanium Level 80PLUS (96% Efficiency)
Dimension / Form Factor 2U Rackmount