Invento i652 Purley Series

i652

Invento i652 Purley Series

Four hot-pluggable systems (nodes) in a 2U form factor.
Each node supports the following:
  • Compute Intensive Application
  • HPC, Data Center
  • Enterprise Server
  • Financial Analysis
  • Mission-critical applications
  • Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
  • Up to to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM; 16 DIMM slots
  • 2 PCI-E 3.0 x16 slots
  • 3 Hot-swap 3.5" SATA3 drive bays 10. Flexible Networking support via SIOM;
  • Dedicated IPMI 2.0 LAN
  • 2200W Redundant Power Supplies Titanium Level (96%)

Specification

Model i652
Processor Support 2 X 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
Core Logic Intel® C621 Chipset
Memory
  • 16 x DIMM slots;
  • Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
PCIe Expansion Slot 2 PCI-E 3.0 x16 slots
RAID Options SATA3 (6Gbps); RAID 0, 1, 5, 10 support
Drive Bays 3 Hot-swap 3.5" SATA3 drive bays
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Networking 1 RJ45 Dedicated IPMI LAN port
Graphics ASPEED AST2500 BMC
Power configurations ACPI Power Management
Onboard I/O
  • SATA: 3 SATA3 (6Gbps) ports
  • USB: 2 USB 3.0 ports total (rear)
  • VGA: 1 VGA port
  • Serial Port / Header: 1 Fast UART 16550 port / 1 Header (internal)
  • Others:
    • 2 SATADOM support on the motherboard
    • 1 NVMe or 2 SATA M.2 (22x80/60/42 mm) support with option part
    • M.2 and SATADOM are for OS boot and they cannot coexis
Power Supply 2200W Redundant Power Supplies 80PLUS Titanium Level (96% Efficiency)
Dimension / Form Factor 2U Rackmount