Invento i6609

Invento i6609

i6609

Invento i6609

Salient Features
  • Supports Dual Intel® Xeon® 6 processors with air cooling
  • Up to 32 DIMM slots
  • Min. 5 PCIe slots
  • 8/12 × 3.5” hot-swap NVMe / SATA / SAS drive bays
  • Flexible networking options
  • 4 × 8cm heavy-duty PWM fans with optimal fan speed control
  • 800W / 1200W / 1600W / 2000W Redundant Platinum/Titanium level power supplies

Specification

Model i6609
Processor Support
  • 2 × Intel® Xeon® 6 processors
  • Max up to 350W TDP
Core Logic System on Chip
Memory
  • 32 × DIMM slots
  • RDIMM / RDIMM-3DS DDR5: 6400 MT/s (1DPC), 5200 MT/s (2DPC)
  • MRDIMM: 8000 MT/s (1DPC) – P-Core only
  • Up to 8TB RDIMM
  • 8-Channel DDR5 RDIMM / MRDIMM
Expansion Slot
  • PCIe Slots:
    Up to 5 × PCIe Gen 5.0 x16/x8 slots
    Up to Dual PCIe Gen 5.0 ×16 OCP 3.0
  • M.2 Slots:
    2 × M.2 PCIe 4.0/5.0 ×4 (2280 / 22110, M-Key)
Graphics ASPEED AST2600 BMC
Indicators
  • HDD activity
  • LAN activity
  • Power fail
  • Power status
  • System information (UID)
IPMI
  • IPMI v2.0 support
  • Virtual media over LAN & KVM-over-LAN
Drive Bays 8/12 × 3.5" hot-swap NVMe / SATA / SAS drive bays
Cooling Feature 4 × 8cm heavy duty fans with optimal speed control
Onboard I/O
  • 4 × USB 2.0/3.x ports
  • Dedicated IPMI Management Port
  • 1 × VGA port
  • 1 × TPM Header
Power Supply
  • 800W / 1200W / 1600W / 2000W Redundant Platinum/Titanium level PSUs (92–96% efficiency)
Standards Compliance
  • PCIe Gen 5.0 Compliant
  • USB 3.0 / 2.0 Supported
  • ACPI 6.3 Compliant
OS Support / Compatibility
  • Windows Server (Latest)
  • RHEL / SUSE Linux / Ubuntu
  • VMware / Hyper-V
  • Oracle Virtualization / RedHat Virtualization
Operating Environment
  • Operating Temperature: 10°C – 35°C
  • Non-operating Temperature: -40°C – 70°C
  • Humidity: 85% operating / 90% non-operating
Dimension / Form Factor 2U Rackmount