Invento i8216 Series

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz; in 16 DIMM slots
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
Dual LAN with 10GBase-T with Intel® X722 + X557
16 x 3.5" hot-swap SAS/SATA drive bays
Five Cooling Fans
1200W/1000W Redundant High-efficiency Titanium Level Power Supplies (96% Efficiency)

Model	i8216
Processor Support	2 x 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
Core Logic	Intel® C622 Chipset
Memory	16 x DIMM slots; Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz OR 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots; Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Expansion Slot	PCI-E Slots 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x86 M.2 M.2 Interface: PCI-E 3.0 x4 Form Factor: 2260, 2280, 22110 Key: M-Key
RAID Options	SATA: Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Drive Bays	16 x 3.5" hot-swap SAS/SATA drive bays Optional 2 x 2.5" hot-swap drive bays
Network Controller	Dual LAN with 10GBase-T with Intel® X722 + X557 1 x RJ45 Dedicated IPMI LAN port
Cooling Features	2 x 8cm hot-swap exhaust fan(s) & air shroud 3 x 8cm hot-swap redundant PWM cooling fan(s)
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC
Onboard I/O	USB: 2 USB 2.0 ports (2 rear), 2 USB 3.2 Gen1 ports (2 rear) Video Output: 1 VGA port(s) Serial Port / Header: 2 COM Ports (1 rear, 1 header) TPM: 1 TPM Header
Power Supply	1200W/1000W Redundant High-efficiency Titanium Level Power Supplies (96% Efficiency)
Dimension / Form Factor	3U Rackmount